Technology at FerraLink

FerraLink combines decades of expertise in hermetic glass-to-metal and ceramic-to-metal seal technologies with cutting-edge thermal management solutions. Our products are engineered for high-reliability microelectronics and semiconductor applications, ensuring robust protection, electrical integrity, and long-term durability for mission-critical devices.

Core Technologies

Explore our advanced hermetic seal packaging and ceramic heat sinks.

Hermetic Sealing

Glass-to-Metal Seals: Precision-engineered for maximum hermeticity and electrical performance in microcircuits, sensors, and optical modules.
Ceramic-to-Metal Seals & HTCC Packages: High Temperature Cofired Ceramic (HTCC) packages deliver superior insulation and reliability for harsh environments.

Advanced Heat Sink Solutions

Silicon Carbide (SiC) Heat Sinks: High thermal conductivity and stability for extreme performance in power electronics and industrial systems.
Aluminum Nitride (AlN) Heat Sinks: Excellent thermal management and electrical insulation, ideal for high-power semiconductor devices and optoelectronic applications.
Custom ceramic heat sinks designed for advanced cooling and optimal device performance..

Custom Metalworking & Machined Housings

Advanced metalworking capabilities for connectors, headers, substrate solutions, and machined housings.

Optical Windows & Covers

Specialized lids and covers for optical and optoelectronic components, ensuring precise alignment and environmental protection.

Solutions

Custom packaging for advanced semiconductor applications.

Precision

Quality

info@ferralink.com

+1617-855-8058