FerraLink

Advanced Materials Precision Packaging Reliable Connectivity

Ferralink empowers technology leaders with engineered solutions for heat management, device integration, and data transmission—built on decades of materials and manufacturing expertise.

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ALN & SiC Submounts

High-performance ceramic submounts for efficient heat sinking and RF applications. Ideal for laser diodes, high-power electronics, and demanding industrial systems.

Precision-engineered transistor outline (TO) headers for optical, laser, and electronic device packaging. Designed for reliability and seamless integration.

Cost-effective, dependable optical transceivers for data communications, industrial, and specialty connectivity needs.

TO Headers

Optical Transceivers

Why Ferralink?

Material & Manufacturing Expertise: Specialists in ALN, SiC, and advanced packaging
Quality & Precision: High-tolerance processes for mission-critical applications
Customer Commitment: Fast turnaround, responsive support, and engineering partnership

Industries We Serve

Data Communications
Artificial Intelligence & Computing
RF & Wireless
Aerospace & Defense
Industrial Electronics

Engineering & Custom Solutions

Specializing in hermetic seal packaging and high-performance ceramic heat sinks for advanced semiconductor applications. Our team delivers tailored designs for optical modules, sensors, and chip-level integration—focused on reliability and precision alignment for aerospace, datacom, and industrial-grade needs.

Custom Package Designs

Tailored designs for optical modules, sensors, and chip-level integration with a focus on reliability.

High-Tolerance Manufacturing

Ensuring precision alignment and thermal management for aerospace, datacom, and industrial-grade applications.

Innovative Solutions

At FerraLink, innovation drives every project. From proprietary hermetic sealing for semiconductor reliability to advanced ALN/SiC submounts for demanding RF and laser applications, our engineering team delivers breakthrough solutions tailored to your needs. Discover how our custom technologies push the limits of device integration and heat management

High-Performance Packaging

Optimized designs for AI and industrial-grade reliability solutions.

Custom Designs

Precision alignment for optical modules and thermal management.

Thermal Management

High tolerance manufacturing for diverse technology-driven solutions.

Customer-Centric Approach

Commitment to clean design and manufacturing excellence support.

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Ferralink's hermetic seal packaging exceeded our expectations, providing unmatched reliability and precision for our semiconductor applications. Their support was exceptional throughout the project.

Tech Innovator

★★★★★